High-density Matrix Module

Our company adopts high-density packaging and integrated backplane to achieve large-scale high-density matrices, which can save users the trouble of configuring by themselves or using additional special matrix expansion kits. All the matrices we provide use through-hole relays (not surface-mounted), and standard desoldering tools can be applied, thus simplifying maintenance and reducing downtime. Our large-scale high-density matrix design ensures that the matrix can achieve high performance, high signal bandwidth, and fewer system execution errors.